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Conductive adhesive offers fast low-curing temperature
LDO delivers dual 150mA outputs with 1% voltage accuracy

Conductive adhesive offers fast low-curing temperature

Curing in 30 minutes at 80°C, three minutes at 100°C or 10 seconds at 150°C with an electrical conductivity of 4 x 10-5Ωcm, Engineered Material Systems’ latest conductive adhesive, CA-180, is designed for die attach and general circuit assembly applications. CA-180 is suitable for temperature-sensitive applications, as well as those which require high conductivity interconnects.
5 May 2015
byNews Desk

CA-180 has a 48-hour work life and a 12,000cP viscosity at 5rpm for easy needle dispensing or application by pin transfer.

CA-180 was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications.

5 May 2015
byNews Desk

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5 May 2015
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LDO delivers dual 150mA outputs with 1% voltage accuracy

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