Adhesive to support faster curing at room temperature

This advanced new assembly solution bonds at room temperature to traditional metals and plastics used in electronics assembly. DOWSIL EA-4700 CV Adhesive also offers low levels of volatile condensable materials to support its use near sensitive electronic components.

Bruce Hilman, Global Segment Leader for Transportation Assembly at Dow Performance Silicones, said: “Electric vehicle and autonomous vehicle development is accelerating across the industry, and engineers globally are seeking innovative solutions to meet safety and reliability requirements while achieving more efficient throughput to produce battery packs and ADAS sensor modules such as RADAR, LiDAR and cameras. 

“DOWSIL EA-4700 CV Adhesive provides durable adhesion and environmental sealing of substrates used in automotive electronic modules, including aluminium, PBT and PPS. Importantly, this silicone adhesive’s ability to provide faster curing at room temperature enables increased throughput for efficient mass production with less use of energy.”

With room temperature (25°C) curing, new DOWSIL EA-4700 CV Adhesive achieves one Megapascal (MPa) adhesion strength within three hours, depending on the substrate material. Using new chemistry and formulation techniques, faster cure times are achieved with reasonable open time and dispensing. Both factors are important to assembly process efficiency. 

By reducing or eliminating oven curing, manufacturers can reduce capital expense and energy usage during operation. The technology used in DOWSIL EA-4700 CV Adhesive also allows heat exposure to accelerate adhesion development, without the risk of voiding. For example, exposure to heat at 80°C, a temperature compatible with most plastic substrates, for less than five minutes allows one Megapascal of adhesion to build on polybutylene terephthate (PBT).

A two-part, primerless adhesive, DOWSIL EA-4700 CV Adhesive cures rapidly after mixing and provides stable adhesion and sealing performance under a typical operational environment of 150°C, thermal shock, and 85°C/85% relative humidity. This advanced assembly solution also has 600% elongation, which makes it suitable for larger modules that experience a coefficient of thermal expansion (CTE) mismatch between substrates.

DOWSIL EA-4700 CV Adhesive is available globally from Dow directly or from Dow’s extensive network of distribution partners.