Component Management

Adhesive featuring low coefficient of thermal expansion

11th July 2018
Alex Lynn

It has been announced that Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. 

EP30LTE-2 is a highly dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,000-26,000psi and its CTE is very low at 10-13x10-6/in/in/°C.

It aims to be a reliable electrical insulator featuring volume resistivity of more than 1015ohm-cm. EP30LTE-2 meets NASA low outgassing specifications and features a combination of physical properties making it ideal for applications in aerospace, optical, electronic and speciality OEM industries where these requirements are critical.

EP30LTE-2 is a two part epoxy which obtains optimal properties when cured overnight at room temperature followed by a heat cure for two to four hours at 150-200°F. This system offers moderate flow characteristics with a mixed viscosity ranging from 70,000 to 100,000cps. In addition to standard packaging units of ½ pint, pint, quart, gallon and five gallon kits, the epoxy is available in premixed and frozen syringes.

Master Bond EP30LTE-2 is a dimensionally stable, low shrinkage compound formulated to provide an extra low coefficient of thermal expansion. It bonds well to a wide variety of substrates including metals, glass, ceramics and many rubbers and plastics. It may be used as an adhesive, sealant, coating or encapsulant and is suitable for applications where resistance to thermal or mechanical stress is important.

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