For production quantities, the circuit carriers are manufactured by injection moulding. To produce prototype quantities using an injection moulding process is much too expensive. As a cost effective alternative, Beta LAYOUT now produces 3D-MID – (Three Dimensional Mechatronic Intergrated Devices)
The PCB-POOL services specialist Beta LAYOUT produces the prototype plastic circuit carriers by 3D printing, which are then coated with a special varnish.
Using laser direct structuring (LDS), the circuit pattern structures such as the interconnections are defined; the laser also activates the pre-varnished 3D printed model which allows for the parts to be metallised. The assembly of the 3D-MID is then performed and completed in-house.
Beta LAYOUT can manufacture 3D-MID prototypes with a maximum size of 300x200x25 mm. Placement of electronic components is also possible. The minimum contact spacing is (pitch): 0.65 mm, the minimum trace width is 0.3 mm and the minimum gap between traces (pitch) is 0.3 mm.