Component Management

3-in-1 SMT production suite provides 240 feeder slots per square metre

16th February 2015
Barney Scott

Essemtec has chosen booth B28, hall 1 at the upcoming AUTOMATICON 2015 exhibition, taking place 17th to 20th March in Warsaw, as the location to highlight its Paraquda combined SMT production centre, able to jet solder paste and/or glue and mount components. One machine platform processes all types of components, from 01005 to large components or connectors.

Short changeover times and a flexible assembly are ensured by 240 feeder slots per square metre, intelligent, servo-driven kitting without production stop and an intuitive, touch screen-based operation.

Paraquda platforms are available in different models. Modular construction allows for a gradual increase in performance, first by placement head choice and second by multiplication of modules as well as an expansion by means of options according to the requested applications.

Depending on the required output, customers can easily exchange the placement heads. Paraquda2 is an identical sister model of the successful pick-and-place system Paraquda4, but with a reduction to 2 Z-axis in the placement head. Paraquda2 can be upgraded to a Paraquda4 at any time with a simple exchange of the placement head.

Thanks to the rental option of a 4 Z-axis placement head, placement performance of production lines can be adapted quickly and flexibly, without investing long term in equipment and tying up valuable capital.

Paraquda combines three different production steps within one platform (jet printing of solder paste and/or glue and SMD assembly).

Prototypes and small series are easily assembled without stencils, reducing turnaround time considerably. Expensive stepped stencils can be eliminated with the dispensing of additional solder paste. Jetting of solder paste allows quicker, more precise solder paste dots than any other system in the market. Everything, from jetting to picking-and-placing components, is done automatically by the machine.

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