The Wi-Fi 4 (802.11b/g/n) and Bluetooth 5.2 Low Energy-enabled devices are designed specifically for next-generation Internet of Things (IoT) products, such as battery-powered medical devices, industrial IoT, rugged handheld devices, and other connectivity solutions.
The modules are powered by the Infineon AIROC CYW43439 chipset solution, supporting reliable and secure performance in industrial IoT settings, supporting a full industrial temperature range (-40°C to +85°C).
Incorporating a fully featured Wi-Fi 4 radio enabled with software drivers and support, the secure, high-performance SDIO solution allows easy integration with any Linux- or Android-based system.
The modules are mechanically and pin compatible with the Sterling-LWB module, offering a simplified upgrade path for existing designs.
They support the latest WPA3 security standards, and the devices’ integrated power amplifier and low-noise amplifier (LNA) ensure reliable connectivity even in challenging RF environments.
The Sterling-LWB+ devices are available with either an on-board chip antenna or a MHF connector for an external antenna, which can connect to range of Laird Connectivity-certified internal antennas.
For development and evaluation, Mouser also stocks the Sterling LWB+ development kit, available with either an on-board chip antenna or a MHF connector.
The modules are certified to FCC, ISED, CE, UKCA, RCM, MIC, and Bluetooth SIG registration, further speeding time to market.
