Communications

V2V technology successfully tested by Audi

7th January 2015
Siobhan O'Gorman
0

Audi has concluded an extensive field test of V2V communications technology developed by NXP Semiconductors and Cohda Wireless. During the test, V2V-enabled Audi vehicles equipped with the NXP RoadLINK chipset drove towards one another at relative speeds of up to 500km/h, communicating across distances of more than 2km. 

In real traffic conditions and at high speeds, RoadLINK delivered outstanding results in the reliability of wireless exchange of warnings, reception performance and communication range. The RoadLINK chipset reduced reaction time and communicated potential hazards and safety-critical scenarios significantly faster than conventional wireless technology.

The intelligent roof antenna, developed by Delphi and based on the NXP and Cohda Wireless RoadLINK chipset, featured in the field test. Communications were protected from manipulation and unauthorised tracking or data access using an NXP hardware secure element.

Aurel Papp, Head of Development EMC/Antenna Components, Audi, commented: “The NXP RoadLINK, chipset combined with the Delphi Automotive roof antenna, delivered the best results so far in our field tests. In challenging test environments, such as intersections in the forest (trees absorb wireless signals at 5.9GHz), the range was better than the previously tested systems. The results demonstrate the benefit of combining NXP’s RoadLINK solutions with the circuit layout and design of the passive antenna emitters by Delphi.”

Andrew Turley, Senior Director of Innovation & V2X Programmme Manager, NXP Semiconductors, said: “The powerful combination of NXP and Cohda Wireless provides auto manufacturers with the secure connections they need to be a part of tomorrow’s smart and connected automotive world.”

Turley added: “The motto of the Audi, NXP partnership is ‘Role Model of Innovation & Speed’. Once again, the high standards of performance, reliability and security provided by the NXP and Cohda Wireless RoadLINK chipset were demonstrated in challenging trials with a premium automobile manufacturer.”

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