TI introduces first SuperSpeed USB-compliant transceiver test chip

Texas Instruments, an active member of the SuperSpeed USB 3.0 promoters group, has introduced a new 5-Gbps transceiver test chip designed to the USB 3.0 specification version 1.0. The new transceiver is capable of driving and receiving signals over 4-m USB 3.0 cables to ensure data integrity. This transceiver will be demonstrated at the USB Developers Conference in Tokyo, Japan on May 21-22.

The new SuperSpeed USB transceiver and Synopsys’ intellectual property digital controller tested successfully at the USB-IF SuperSpeed Peripheral Interoperability Lab. “Demonstrating interoperability between Synopsys’ DesignWare SuperSpeed USB digital controller and TI’s USB transceiver gives designers confidence that the IP functions successfully in a real-world system environment,” said John Koeter, vice president of marketing for the Solutions Group at Synopsys. “Synopsys and TI are working together to help advance new technology into the market quickly, while minimizing risk and speeding time-to-market.”

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