SESUB technology cuts Bluetooth module by 60 per cent

25th January 2016
Mick Elliott

The SESUB-PAN-D14580 Bluetooth v4.1 module from TDK is now being shipped by Mouser Electronics. The ultra-compact, Bluetooth 4.1 Low Energy (LE) micro module is the world’s smallest module for Bluetooth Smart devices. The 3.5mm × 3.5mm × 1mm SESUB-PAN-D14580 module is based on TDK’s proprietary Semiconductor Embedded in Substrate (SESUB) technology, reducing the size by 60 percent compared to modules using discrete components.

The single-mode module’s ultra-compact footprint and low current consumption make it ideal for battery-powered wearable devices where small size, light weight, and low power consumption are essential

The module integrates a Dialog Semiconductor DA14580 Bluetooth 4.1 chip, 32-bit ARM Cortex-M0 microcontroller, and DC-DC converter onto a thin substrate, along with all peripheral circuitry including a 16MHz crystal, induc-tor, and capacitor.

All inputs and outputs (I/O) from the substrate layers are routed to a ball grid array (BGA) footprint on the module’s bottom surface. Interfaces include UART, SPI, and I2C, helping to speed the hardware design process and allowing fast and easy implementation of Bluetooth connectivity.

The low-power module requires a voltage supply of 3.0V, and consumes only 5.0mA when transmit-ting, 5.4mA when receiving, and 0.8µA in standby mode. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics.

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