Rugged industrial box PC with 4G/LTE configuration

The newly added fanless box PC series features dual-core Intel Atom E3825, optional 4G LTE mobile connectivity, DDR3L SO-DIMM memory up to 8GB, mSATA socket, VGA display, wide operating temperature, DIN Rail/Wall-mounting options, and a variety of isolated protected serial COM and LAN configurations for various industrial IoT applications.

LEC-3034 series is powered by Intel Atom E3825 CPU, a dual-core SoC architecture (formerly ‘Bay Trail’) for optimised performance and power consumption in compact computing systems. With onboard M.2 3042 expansion slot with SIM, LEC-3034 supports 4G-LTE mobile connectivity option, which provides more flexibility and scalability for industrial communications in critical infrastructures. Along with support of DDR3L memory and Intel HD Graphics engine, LEC-3034 series meets the market by functioning as a reliable and robust hardware solution for industrial applications.

Different from traditional DB-9 design, LEC-3034 series comes with Phoenix Contact terminal blocks to offer high density and variety of COM port setting based on the ordered models. LEC-3034 series deliver four to eight Serial ports with RS-232/422/485 signals. With 2KV digital isolation and 15KV ESD protection, the Serial ports are well-protected in harsh environments.

Aside from the multiple serial ports, LEC-3034 also features flexible I/O functionality, including two or four GbE LAN ports, two to four USB ports, one mSATA mini slot and a VGA display output.

Regarding environmental ruggedness, LEC-3034 can withstand -40 to +70°C operating temperatures. For mounting installation, the system can be mounted by DIN Rail or wall-mounting.