DDR3/LV-DDR2 SDRAM evaluation platform

The TB-5V-LX110-DDR3 is ideally suited for ASIC/LSI prototyping that can be used to test DDR3 SDRAM with a maximum speed of 1,066Ｍbps and LV-DDR2 SDRAM with a maximum speed of 667Mbps. This is the first FPGA evaluation platform to incorporate a DDR3 SODIMM (small outline dual in-line memory module) socket and is supplied with 1GByte DDR3 memory module. It can support DDR3 memory modules up to 4GByte.

The shift from DDR2 SDRAM to DDR3 SDRAM is already underway in products such as high-end PCs and servers. It is anticipated that use of DDR3 SDRAM will become increasingly widespread in products such as high-end digital consumer electronics and high-speed image processing devices. LV-DDR2 SDRAM is a low-power version of DDR2 SDRAM that can meet the demand from digital consumer electronics for lower power consumption and space saving with an operating power supply voltage of only 1.5V and a 32-bit interface that allows configurations in which two conventional 16-bit DDR2 SDRAMs are replaced with a single device.

DFI 2.0 (DDR PHY Interface) compatible DDR3 SDRAM PHY design for the Virtex-5 and DFI 1.0　compatible LV-DDR2 SDRAM PHY design for the Virtex-5 come with this platform can be realized to reduce total ASIC/LSI development time by a seamless transition from FPGA to ASIC or LSI.

The inrevium TB-5V-LX110-DDR3 provides a flexible evaluation environment with a range of option boards such as DVI, ADC and DAC, Gigabit Ethernet, and LVDS and also the ability to connect to other large-scale FPGA evaluation platforms.