Optimised antenna beamforming for next-gen wireless networks

The need is growing for faster internet communications in line with the increase in bandwidth required by internet contents such as ultra high definition (HD, 4K) video, Augmented Reality (AR), and Virtual Reality (VR).

In addition, constructing wired networks that cover wide areas requires enormous amounts of cables and labour, and the costs of constructing and maintaining this infrastructure are also considerable.

Dubbed LBKA0ZZ1NH-317, the new module is anticipated to be utilised in a wide range of applications such as for communication between mobile phone base stations including next-gen 5G wireless communication, for communication between WiFi hotspots, and for use in wireless communication networks in smart cities.

Murata’s RF module realises optimised antenna beamforming using a proprietary Low Temperature Co-fired Ceramics (LTCC) circuit board capable of facilitating high precision 60GHz band communication.

In addition to communication via a standalone module, by combining multiple modules it is possible to extend the communication range and link outdoor base stations several hundred meters apart for multi-gigabit communication. The LTCC circuit board’s high heat resistance and low moisture absorption ensure operational reliability and enable use even in outdoor base station environments.

The highly efficient antenna module operation realises low transmission line loss between the IC and the antenna thanks to the low loss material characteristics of the LTCC. The modularised RFIC and antenna package eliminates the need to design new millimetre-wave RF circuitry, which reduces the amount of labour required for developing new network equipment.

The module exhibits a high gain of 37.5dBm typical EIRP with CW signal and saturated power. The RFIC in the module is able to support multi-tile RF module operation. It helps users get higher output power, better Rx sensitivity and longer communication distance.