HCP-72i2 is built with a full modular-design, by offering two rear-accessible Intel x86 CPU blades and three front-swappable network blades in a 2U rackmount server. In fact, the three networking I/O blades are hot-swappable through LCM control. This allows high-scalability in telecom applications as the modular blades perform offload duties.
The CPU blades are empowered by Intel Xeon processor E5-2690 v3 series CPU and C612 chipset (Haswell-EP) for extreme high-performance and data processing capability. Meanwhile, regarding data memory, HCP-72i2 supports qual-channel DDR4 at 2,133MHz registered socket with maximum capacity up to 512GB (16 x DIMM sockets for each blade). This hardware blade design ensures ultra low latency and extreme processing power to maximise virtualisation related performance.
In terms of networking I/O density, HCP-72i2 delivers up to 36 x GbE SFP or 24 x 10GbE SFP+, while keeping one management port and one IPMI port.