Vishay - Infrared Emitter With Extremely High Radiant Intensity of 600 mW/sr, High Optical Power to 55 mW, and Fast Switching Times of 10 ns
HiSilicon, a Division of Huawei, Extends License of Tensilica’s IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
COMPRION and MONETECH offer new NFC Test Consulting Service

HiSilicon, a Division of Huawei, Extends License of Tensilica’s IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets

Tensilica announced that HiSilicon Technologies, a division of Huawei, has expanded its license (announced February 9, 2010) for Tensilica’s dataplane processors (DPUs), ConnX(TM) Baseband Engine (BBE16), and HiFi Audio DSP (digital signal processing) semiconductor IP cores for LTE (Long-Term Evolution) basestations, handsets and other network infrastructure and customer premise equipment.

Now that we’ve worked for over a year with Tensilica, we are quite impressed with the capabilities, the ease of use, and the efficiency in terms of power, performance, and area achieved with Tensilica DPUs, stated Teresa He, vice president of HiSilicon. We have used Tensilica’s Vectra and ConnX BBE16 and they are best-in-class for baseband signal processing and can be optimized to improve speed/power/performance. We also have now selected Tensilica’s HiFi Audio DSP core, which provides the performance at the lowest power and comes complete with software support for the major audio and voice standards.
We are very pleased that HiSilicon, the leader in LTE networks, has expanded its use of Tensiliica DPUs through this multi-year agreement, stated Jack Guedj, Tensilica’s president and CEO. Hisilicon’s broad adoption of Tensilica in both mobile wireless and network infrastructure designs is a testimonial to the benefits of our ability to achieve best-in-class performance/power/performance that can be rapidly optimized to precisely tailor to each SOC design without compromise.

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