Communications

Field-deployable computing platform is rugged and reliable

14th May 2014
Nat Bowers
0

Featuring a variety of configurable I/O for maximum design versatility, the S50J computing platform has been introduced by Elma Electronic. The highly reliable and rugged field-deployable system is suited for applications where system reliability is paramount and environmental conditions can be extreme, such as signal processing, hyperspectral imaging, tactical command and control as well as surveillance and reconnaissance.

Virtually any I/O scheme can be supported using tailored I/O panels, and the S50J also features expandable aluminium sidewalls for easy sizing. Using application-specific I/O expansion cards, the S50J can easily accommodate video compression and frame grabbers, ARINC and 1553 cards, WiFi, CANBus, data storage, or FPGA and GPGPU processing.  This facilitates easier system configuration to cost-effectively support programme evolution, while mitigating design risks.

The feature-rich EPIC-based embedded board in the S50J features a high performance, yet low heat generating, Intel Core i7 processor with an Intel QM57 Express Chipset.  The full system incorporates 10 gigabit Ethernet ports, up to six USB 2.0 and four SATA ports and eight independent serial ports. Support is available for both Linux and Windows.

IP65-rated for protection against dust as well as low pressure water jets from all directions, the S50J delivers reliable performance in dusty, humid and wet environments and when exposed to extreme temperatures from -20 to +60°C.

The rugged system platform incorporates a thermally conductive base as well as ribbed top and bottom covers to provide convection and conduction cooling for superior thermal management.  Additional features include EMC shielding, compact dimensions of 10.5x9x4.75" (267x229x121mm) and a weight of 14lbs (6.4kg).

Pricing for the S50J starts at $6,100 (USD) in quantities of 10 and is configuration dependent. Lead time is 12 weeks ARO.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier