Communications

Embedded PC features high bandwidth DDR3 SO-DIMM memory

10th November 2015
Nat Bowers

Amplicon has announced a lightweight, compact, fanless embedded PC which features an Intel Core 3rd gen mobile processor supported by high bandwidth DDR3 SO-DIMM memory. The Impact-E 200HT utilises the QM77 chipset that introduces high bandwidth SATA III allowing for data transfer speeds up to 6Gb/s. It ensures that the data bus bottleneck, which previously hindered data transfer speeds, is now a thing of the past.

Other features include high speed data transfer, RAID functionality and the option for two mechanical/solid-state drives. Furthermore, the Impact-E 200HT uses Intel HD Graphics 4000. This allows for high-resolution graphics on all three-display outputs and allows support for both DirectX and OpenGL graphics rendering options. The embedded PC utilises SuperSpeed USB 3.0. This provides USB transfer speeds of up to 5Gb/s on four rear mounted ports. These ports also allow for backwards compatibility to USB 2.0 and 1.1 for legacy peripherals.

The Impact-E 200HT can house up to 16GB DDR3 memory ranging from 1066 up to 1600MHz; this enables the unit to handle various memory intensive applications that some larger PCs on the market would find a problem.

Being a compact design and weighing less than 2.5kg, this unit is ideal for installations where space is at a premium and temperatures are extreme. This compact system allows expansion for additional solid state or mechanical hard drives with optional expansion for WiFi connectivity.

The Impact-E 200HT embedded PC system is suited to applications in various markets such as transportation, security and automation.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news