Belden Introduces New Hirschmann PowerMICE Modular Switch
ADLINK CoreModule 920 with 3rd Generation Intel Core Processor Delivering Highest Performance at Low Power
Hylec-APL Weatherproof Connectors Provide Peace Of Mind

ADLINK CoreModule 920 with 3rd Generation Intel Core Processor Delivering Highest Performance at Low Power

ADLINK Technology introduces its newest Extreme Rugged CoreModule offering. The ADLINK CoreModule 920, with outstanding mechanical, thermal and power design, is able to support Intel Core i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.

Integrating a dual-core 3rd generation Intel Core i7 processor running at up to 2.8GHz with Turbo Boost, up to 4GB of solder-down DDR3 ECC memory, 8 GB of industrial grade SSD, as well as a fast data-transfer SATA 6 Gb/s interface, the CoreModule 920 boosts the highest specification of PC/104 products available on the market and supports rich graphics performance with versatile video outputs including HDMI, VGA and LVDS. The CoreModule 920 is expected to usher in many new applications for embedded systems and is also available with an economically-priced Intel Celeron CPU option.

Compliant with the PCI/104-Express Type 1 standard, the CoreModule 920 provides both PCIe and PCI connectivity and allows for SATA 6 Gb/s data transfer. Space and cost savings are provided by the PC/104 family’s inherent self-stacking bus which allows modules to stack together like building blocks without backplanes or card cages. This stacking feature also delivers high reliability as it uses four-corner mounting holes which can resist shock and vibration. The CoreModule 920 extreme ruggedness is also a result of its specially designed PCB, which is 50% thicker than ordinary PCBs, and an extended operating temperature range of -40°C to +85°C.

The CoreModule 920 implements a heat spreader design which allows for more flexible thermal solutions to enable a higher component density not common to its PC/104 family predecessors. Its customized BIOS allows users to underclock the CPU and reduce total power consumption as well as heat generation.

The CoreModule 920’s unique mechanical, power-saving and thermal design maximize the outstanding features of the PCI/104-Express form factor, setting a new benchmark for embedded solutions in the PC/104 family at comparatively low power consumption and cost.

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