Bluetooth SIG names Telink co-founder associate member director

22nd July 2019
Alex Lynn

The Bluetooth Special Interest Group (SIG) announced that Haipeng Jin, co-founder of Telink Semiconductor in Shanghai, has joined the board of directors of the Bluetooth SIG as an Associate Member Director to serve a two-year term starting in July 2019.

The Bluetooth SIG Board of Directors is responsible for the governance of the organisation and plays a vital role in driving the expansion of Bluetooth technology to address the needs of a growing number of consumer and commercial markets. 

“The addition of Haipeng Jin from Telink to the Bluetooth SIG Board of Directors is an honour and we look forward to Haipeng’s expertise and creativity,” said Mark Powell, Executive Director of the Bluetooth SIG. “With the rapid growth of Bluetooth to provide commercial and industrial solutions such as connected lighting, asset tracking, and access control, the expertise Telink provides will be beneficial as Bluetooth continues to add capabilities and enhance the technology to meet market demands.”

Haipeng Jin is the co-founder and engineering vice president of Telink Semiconductor, currently leading the daily operations of Telink’s research and development (R&D) and product team. An integral and important part of Telink’s success in diversified System-On-Chip (SoC) offerings, Haipeng brings years of experience in developing and commercialising innovative low power wireless IoT technologies. Haipeng has numerous patents in his name worldwide and is an expert in wireless communications from the physical layer to application layer. 

With this appointment, the Bluetooth SIG board now consists of individuals from the following member companies; Apple, Bose, Ericsson, Intel, Lenovo, Microsoft, Nokia, Telink Semiconductor and Toshiba.

Featured products

Upcoming Events

View all events
Latest global electronics news