BLE module fits space-constrained applications
What is claimed to be the world’s smallest Bluetooth Low Energy (BLE) SiP module from Silicon Labs is available at Solid State Supplies. With a package size of 6.5mm x 6.5mm x 1.4mm the BGM11S Blue Gecko SiP (System in Package) module targets applications where ultra-small size, reliable high performance RF, low power consumption, full modular certification and easy application development are key requirements.
This highly integrated SiP solution is a complete Bluetooth subsystem with on-board radio transceiver, antenna, serial interfaces, core processor, memory, clock management, I/O, timers, triggers, hardware security and power management.
Based on a high performance 32-bit 38.4MHz ARM Cortex-M4 processor with 256kB of flash program memory and 32kB of RAM data memory integrated the low power device consumes just 8.7mA when operating and 2.5μA in deep sleep mode due to the integrated energy management circuitry.
The BGM11S is Bluetooth 4.2 compliant and compatible with Bluetooth 5 advertising as well as being Bluetooth mesh capable.
The integrated antenna offers up to +8dBm transmit power and -90dBm receive sensitivity, requiring minimal PCB, plastic and metal clearance to deliver exceptional performance up to a range of 200 metres.
The inbuilt metal shield enables full modular certification for worldwide regulatory compliance, allowing end products to be certified with minimal effort.
The module’s small physical size requires just 51mm2 of PCB area. It is targeted at space-constrained applications including IoT devices, wearables, asset trackers, mobile healthcare and Bluetooth beacons.
Commenting on the launch Matt Cook, Silicon Lab Product Manager at Solid State Supplies said: “This is a truly market leading product in terms of features, size, power consumption and cost. In space constrained applications where traditionally a chip design route would have been taken, the ease of integration and cost points make the BGM11S a compelling solution for the most demanding of applications. We look forward to supporting our customers as they enhance their products with this device.”