“Cloud computing, virtualization and the proliferation of large video files have data center equipment manufacturers keenly focused on expanding bandwidth,” said Sergis Mushell, principal research analyst at Gartner. “For semiconductor companies, integration and manufacturing prowess are keys to keeping pace with data rate requirements in this space.”
“Avago customers have been well pleased by our ability to deliver first-time-right ASIC silicon, which played a big part in surpassing 150 million SerDes cores shipped,” said Frank Ostojic, vice president and general manager of the ASIC Products Division at Avago. “We have repeatedly set new industry standards for performance benchmarks with our SerDes cores to help data center equipment OEMs keep up with bandwidth demands.”
In November 2010, Avago announced it was first to demonstrate 28-Gbps SerDes performance in 40-nm Complementary Metal–Oxide–Semiconductor (CMOS) process technology. Avago will also exhibit its 40-nm SerDes in the Tyco Electronics booth (#515) and the Amphenol booth (#101) at DesignCon 2011.
Avago Intellectual Property (IP) SerDes cores can be easily integrated due to their modular, multirate architecture. Avago is able to integrate up to 400 SerDes channels or over 190 million gates on a single ASIC, with transistor counts in excess of 4 billion. The Avago SerDes cores feature a unique decision feedback equalization (DFE) architecture, resulting in a number of key performance differentiators such as low overall power, best-in-class data latency, and best-in-class jitter and crosstalk tolerance.
Avago has an established history of delivering reliable, high-performance ASICs. Three decades of design experience, state-of-the art hierarchical design methodology, and an IP portfolio covering multiple standards, form the company’s foundation for supplying complex ASICs to the wired communications market. The broad Avago SerDes portfolio supports a wide range of standards such as PCI Express, Fibre Channel, XAUI, CEI-11G, 10GBASE-KR and SFI, providing the flexibility to address optical, copper and backplane applications.