Smiths Interconnect has announced the launch of EZiCoax, a single-piece, compression mount, 50-ohm RF coaxial contact for use in board-to-board signal transmissions with data frequency up to 40GHz.
EZiCoax enables secure, precise, and reliable data signalling in high-value aerospace and defence applications, such as satellite communications and advanced radar systems.
Smiths Interconnect brings decades of expertise to the design of spring-compliant contacts and interposer connectors. EZiCoax leverages this heritage, employing spring probe technology in both its centre and outer conductors to create a fully compliant connection between printed circuit boards (PCBs). The smallest coax offering has a low profile, down to a 3.30mm board-to-board distance, and can be used on a pitch as small as 3mm. EZiCoax delivers exceptional performance, with data frequency up to 40GHz. It is designed to be incorporated into interposer solutions that ensure alignment and offer the opportunity to integrate various types of signal and power contacts, as well as additional features such as gasketing and bosses, which further enhance compliance and versatility.
The development of EZiCoax is Smiths Interconnect’s answer to the demand from leading players in the market for solderless, compression mount solutions in High-Frequency data signalling.
Mark Kelleher, Connectors BU Director at Smiths Interconnect, commented: “EZiCoax is an effective solution developed to meet the strict requirements of the most demanding applications. With its recognised advantages in terms of ease of assembly and rework, this solution helps reduce production scrap by minimising the risk of damage to both PCBs and connectors during the assembly process. Compared to traditional solder SMP connectors, EZiCoax interposers, with lower mating and unmating forces applied to the PCBs and the reduced use of board stiffeners, deliver a reliable and customisable solution, allowing the integration of mixed digital and power contacts in one array.”
EZiCoax is a solderless solution that requires no solder on the PCBs for connection. Each contact needs less than 5oz. compression force to provide a reliable connection, and no extraction force is required for a spring-loaded solution. EZiCoax requires little assembly work; it is sufficient to align it to the PCB and compress for a reliable connection. Hence, EziCoax interposers can be installed and uninstalled with minimum effort. Furthermore, the minimal forces involved mean that EZiCoax interposers can withstand a higher number of mating and de-mating cycles, offering a lower cost of ownership compared to existing commercial solutions, with reduced maintenance requirements and an extended product lifespan.
EZiCoax interposers are inherently compliant and provide reliable blind-mate capabilities. They are an ideal approach for quickly disconnecting applications during system repair or replacement. EZiCoax Interposers can effectively overcome target misalignment as spring probe connectors are compliant by design and require only a flat pad as their target. Contact is maintained as long as the probe tip touches any point within the target, ensuring forgiveness of any misalignment.
EZiCoax Interposers can operate at frequency rates for data signalling up to 40GHz with minimal insertion loss (less than -1dB). They are designed to offer superior shielding from stray signals and provide excellent cross-talk characteristics. The capability to perform up to the Extremely High Frequency range (EHF) and the superior mechanical and electrical reliability make EZiCoax suitable for the most demanding data signalling applications, including:
- Satellite-to-ground and inter-satellite communications that enable secure and effective mission control coordination
- Ground and air-to-ground advanced radar systems for precision targeting, enhanced surveillance, and the detection of threats and collision risks in defence and space environments
- 5G and future-generation wireless networks for ultra-high-speed communication
