SMD power elements suit fully automated production processes

23rd March 2015
Siobhan O'Gorman

SMD power elements, designed for applications where no holes on the PCB are allowed or a fully automated production process is given, have been released by ERNI Electronics. The SMD variants, which expand the company’s portfolio of PowerElements, are available in blister packaging for fully automatic assembly. 

The power elements have a round base body, which is rotationally symmetrical. The diameter of the SMD pad should be at least 0.5mm greater than the diameter of the base body of the selected power elements.

ERNI provides variants with male and female threads and female threads throughout. Threads range from M3 to M10. In addition, elements with spigots for a high positioning accuracy are available. In the case of elements with a spigot, an additional non-plated through hole with a drilled diameter of 1.2mm must be provided in the centre. In the case of elements with a through hole, additional non-plated through holes must also be provided, depending on the diameter of the base body.

The current rating per SMD power element is specified with up to 200A. In addition to the standard versions, the power elements with UNC thread or customer specific modifications are available. The SMD variants enable PCB connection for fixing cable lugs.

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