The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates swivel lid with compression screw, so that IC’s can be changed out quickly. The socket features a floating compression plate to force down the QFP leads on to elastomer. There is also a hard stop feature built into the compression mechanism.
The SG-QFE-7011 sockets are constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and PCB. The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.
Pricing for the SG-QFE-7011 is $474 at qty 1; with reduced pricing available depending on quantity required.