The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The socket incorporates a heat sink and a fan to dissipate 60 Watts. The socket also features integrated compression mechanism to socket lid enabling easy change of BGAs. The specific package sizes accommodated by the socket are 1mm pitch 40mm x 40mm, 39×39 ball array. To use, drop IC into the socket, and apply down force using heat sink compression socket lid.
The SG-BGA-8030 sockets are constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and PCB. The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.
Pricing for the SG-BGA-8030 is $2388 at qty 1.