Available in variants that include PCB-to-PCB, PCB-to-flying-lead and PCB-to-flex, the HDLP series is designed to reduce the PCB real estate necessary for making data connections. PCB-to-PCB options include stacking and card-edge versions, for even greater flexibility. The connectors include an interfacial seal and encapsulated contacts to achieve a high level of sealing, with optional conformal coating available to provide further environmental integrity.
The HDLP series uses Hypertac’s hyperboloid contact technology to reduce contact resistance and achieve low mating/unmating forces. The resulting connectors exhibit excellent reliability, even under high levels of shock and vibration. They are specified to withstand over 2000 mating cycles, allowing thorough system testing, quick and reliable maintenance and overall lower cost of ownership. The excellent current handling capabilities of the hyperboloid technology (up to 1A per contact at 110V DC) allow higher density of interconnection than is attainable using other systems.
All of the connectors in the HDLP range are available in surface mount or through-hole versions. The devices are designed to be assembled using automated pick-and-place machinery, reducing production costs and providing good design for manufacture characteristics. A polarised reinforced thermoplastic insulator eliminates mis-mating. Standard HDLP connector configurations are 30-, 58-, 90- and 118-ways.