The new socket type is superbly suited for the test and burn-in of smaller QFN packed semiconductor modules which are used in mobile phones, digital cameras and the automotive field. The series spectrum ranges from 5×5 mm to 7×7 mm external dimensions with pitches of 0.4 mm or 0.5 mm as well as a pad number of 28 – 56 (without centre pad).
The new open-top QFN socket series has a high-precision 0.4 mm or 0.5 mm fine pitch contact system with a compact socket construction at the same time. This facilitates automatic loading and unloading of the burn-in board and also helps to reduce costs and changeover times. The socket design was developed as a highly reliable solution for all requirements in the test & burn-in field. The uniform push-cover design enables the use of a universal change kit of the automatic loader.
The IC specific positioning aids allow the adaptation of different IC types to only one standard socket size. The push-cover for automatic handling is designed especially sturdy to prevent damage to the socket. Actuating the push-cover enables easier insertion of the module. When releasing the push-cover, the IC is first centred across all four corners and then fixed in place with the latches. This ensures the necessary contact force and at the same time achieves a very low and reliable conversion resistance.
The contact mechanism utilises the concept of twin-beam contact. This contact pin combines guaranteed excellent mechanical as well as electrical characteristics:
1. Durable stable contact design with simultaneous lowest mechanical module pad wear, i.e. no degradation of the contact force as well as minimised contact movement on the module pad.
2. Reliable and low contact conversion resistance even with different module pad surfaces.
An integrated centre pin ensures the electrical bonding of the exposed pad as well as additional thermal dissipation.