The devices offer outstanding mating performance, high durability and minimal contact resistance for applications where interconnect failure is simply not an option. Further benefits include high current ratings, low circuit resistance and EMI/RFI shielding.
Glenair’s QPL 83513 Micro-D and COTS connectors feature Glenair’s high-density micro TwistPin contacts set on .050 centres in arrangements from 9 to 130 contacts. Thanks to special material selection, fabrication and heat-treating techniques, TwistPin contacts resist high temperature stress relaxation for up to 1000 hours at 125°C.
Available with insulated and uninsulated wire, PCB, solder cup and flex terminations, as QPL or commercial variations, the Micro-D devices provide a reliable solution for all high-performance interconnect requirements including high temperature and hermetic applications.
Space-grade Micro-D connectors with NASA and ESA screening options are also available. The products are manufactured in the UK for short lead times in Europe as well as in the USA. In the UK Glenair also designs Micro-D solutions.
