Cables/Connecting

Planar Arrays on Shorter Lead Times Thanks To "Lean" production process

23rd March 2006
ES Admin
Syfer Technology hopes to reduce lead times for its planar arrays by a third thanks to what it calls a lean manufacturing programme that will look at all elements of waste, including time, within its manufacturing processes.
Ron Inglis, Syfer’s Manufacturing Manager comments: “This program will change the way we do things at Syfer and will create a major competitive advantage for us and our customers”.

Planar Arrays are complex EMI filtering devices, used in filtered connectors, containing combinations of capacitors, ground lines and feed-throughs. A single array can contain up to 155 capacitors, in up to four different capacitance values, with a choice of dielectric, planform and voltage rating. It is truly the most complex device within the multilayer capacitor industry, and is typically a custom designed, application specific part.

Syfer’s planar arrays are available in a range of capacitance values, from 47pF to 4nF (C0G) and 250pF to 600nF (X7R). They can be supplied to suit a broad range of connector types; including the popular nanoD, microD and subD types, as well as circular and ARINC type connectors. Syfer’s innovative and unique ‘wet stack’ manufacturing process, minimises shrinkage and enables the production of both very small and very large planar arrays.

A stress-free component is produced with mechanical precision, enabling a filter assembly to withstand the most rigorous of electrical specifications.

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