New connectors deliver high current density

29th June 2018
Alex Lynn

The introduction of ELCON Micro power connectors has been announced by TE Connectivity. The connectors deliver high current density in a commonly used industry footprint of 3mm. The new connectors provide 12.5A per pin, making them useful for servers, switches, storage devices and testing machines.

By using a common industry footprint, TE’s ELCON Micro power connectors allow for easy upgrades to existing designs. The 3.0mm Printed Circuit Board (PCB) footprint is compatible with Molex’s Micro-Fit headers and BellWether’s Micro-Hi headers.

These new connectors support two to 24 pin configurations and perform reliably in harsh environments due to their maximum operating temperature of 105°C, and their halogen-free material. Additionally, the connector housing is designed to prevent mis-mating, making assembly easier for our customers.

Henry Xie, power product manager at TE Connectivity, stated: “High power and reliable connectivity in an easy-to-use form factor are the key features of our new ELCON Micro power connectors. With a working voltage of 600V and the ability to support different currents with multiple combinations of different wire sizes, these connectors offer the flexibility and performance to make them standouts in the power connector market.”

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