Molex Stac64 Connection System Meets Electronic Device Requirements in Today’s Vehicles
Molex has introduced the Stac64 connection system, which provides single and multi-pocket PCB solutions to offer a diverse range of circuit sizes and greatly reduce time-to-market by completely eliminating custom tooling.
The new stackable connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a large range of signal and power needs for devices and modules.
“By listening to customer and industry needs, we developed the Stac64 connection system to address the growing electronic device requirements within today’s vehicles,” said Michael Gonzalez, Global Product Manager. “We designed an approach that greatly reduces device packaging complexity and allows automotive device tiers to bring products to market much faster.”
The standard product line, based on the 0.64mm (.025”) terminal, includes 8-, 12-, 16- and 20-circuit connectors in both vertical and right-angle headers supporting low-level signal requirements. An additional 10-circuit ‘power pocket’ version, supporting power applications for 1.50 and 2.80mm (.059 and .110”) terminal systems, is available in vertical and right-angle configurations.
“The Stac64 standard product offering is currently released and is fully validated at the single-pocket level. When ganging individual headers together to form a larger header assembly, no additional performance validation is necessary,” adds Gonzalez. “Plus, the pre-assembled, linear Mylar® polyester film PC tail alignment strip for right-angle headers protects the pins through shipment and processing and provides additional PCB space savings. The concept also addresses wire harness assembly efficiencies by colour-coding different connector pockets to aid with vehicle assembly.”
The PCB alignment posts ensure all terminals are properly aligned into PCB through-holes during assembly and retain the header to the PCB during assembly and solder processing. In addition, PCB stand-offs moulded into housings provide additional trace-routing real estate under the headers.
Stac64 is a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications. The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP – United States Council for Automotive Research/Electrical Wiring Component Applications Partnership – (http://ewcap.uscarteams.org) industry footprints. High temperature thermoplastic housings withstand infra red (IR) and wave lead-free solder processing per ES-40000-5013 Molex specification.