Molex Introduces New 85 Ohm Addition to Impact Backplane Connector System

20th February 2009
ES Admin

Molex has introduced the latest addition to its Impact backplane connector family of products, Impact 85 Ohm, to meet the growing demands of next generation server, storage and data networking equipment. Molex’s new Impact 85 Ohm connector system is designed to support the Intel Quick Path Interconnect (QPI) standard, PCI Express Generation 2.0 and 3.0, as well as any proprietary system design where 85 Ohm differential impedance is desired.

To allow designers the flexibility of interchanging 100 Ohm and 85 Ohm signal modules based on system needs, Molex designed both connector systems to be of the same physical size, density, pitch and PCB layout, as well as using the same guidance and power solutions. Therefore, to avoid confusion between the Impact 85 Ohm and the 100 Ohm lines, Impact 85 Ohm is offered in a light grey LCP so that designers can visually “colour code” their designs.

Impact 85 Ohm also uses the existing Impact 100 Ohm connector compliant pin and mating interface designs, saving designers the time and cost to re-qualify the critical-to-function portions of the connector system. These proven designs offer superior electrical and mechanical performance compared to other backplane connectors on the market today.

Molex continues to expand its Impact backplane connector family. It is now tooled and available in 2-, 3-, 4-, 5-, and 6- pair traditional backplane header and daughtercard connector versions that support differential signal densities ranging from 27 up to 80 pairs per linear inch, with a complete range of guidance, power, coplanar, mezzanine and high performance cable solutions.

Featured products

Product Spotlight

Upcoming Events

View all events
Latest global electronics news
© Copyright 2023 Electronic Specifier