ITT’s Cannon lightweight filter connector technology withstands high shock and vibration
Launching in Europe at the DSEI Exhibition, ITT’s new Cannon Chip on Flex (CoF) filter technology virtually eliminates all stress from thermal shock and vibration while providing superior protection to sensitive electronics in a new lighter weight package. In MIL-DTL-38999 configurations, the CoF connectors have passed MIL-DTL-38999 Series III testing for thermal shock, random vibration, humidity and high altitude. The filter connectors are ideal for high reliability military, aerospace and industrial applications including integrated avionics, radio and navigation systems, fire control devices, electronic counter measures, satellite communications and data transmitters.Chip
Cannon’s CoF design replaces the internal and traditional ceramic planar array block capacitors with a state-of-the-art flexible circuit where individual chip capacitors are surface mounted on a pad adjacent to the feed thru contact. Since the feed through contacts are not soldered directly to the capacitor, thermal stress points that impact performance in thermal shock and vibration have been virtually eliminated.
The result is a very robust filter connector with superior mechanical performance and improved reliability. In addition, because the flex is significantly lighter in weight, a connector weight reduction of up to 15% is achieved for the MIL-DTL-38999 configurations.
CoF filter connectors provide all the standard filtering capabilities, such as individual isolated pin filtering of high-frequency noise, built-in ground plane barriers in the connector inserts, and filtering at the face of system boxes. The approach offers the system designer complete flexibility in defining or changing individual circuit capacitance, ground and EMP performance during the design/development phase – eliminating any need to retool the ceramic planar array.
The Cannon CoF design utilizes readily available flex circuits and active components leading to reduced design/development cycle times, overall hardware delivery lead times and cost.