The ITT UC for angular alignment applications has a sloped front beam which enables a mating angle of 90 degrees and still retains the same overall dimensions as a standard UC. Features include 2.5mm free height with 1.0mm of deflection and X-Y-X movement with the mating device. A solder well prevents wicking of flux solder into the critical beam area and side wings prevent beam overstress. Further features include a domed contact for high hertz forces and 0.3N of pre-load force minimum. The pitch between contacts is 1.35mm.
Electrical specifications include a voltage rating of up to 500VDC.
Applications include handsets, where the new contacts can be used for solderless component and I/O interconnects as well as battery and antenna contacts. Further applications include memory sticks, GPS board to screen interconnects, CT scanning equipment, key fobs and smoke detectors.