Interconnect system enables 85 % board space savings

TE's AMPMODU 1.0mm Centerline interconnect system offers an 85 % space savings on the board when compared to the standard 2.54mm pitch connectors.

A dual-beam contact design provides a reliable electrical connection even in severe shock or vibration environments.

The interconnects serve a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

Applications include industrial controls, building and home automation devices, servo drives, programmable logic controllers (PLCs), I/O devices, telecommunication equipment, robotics, and instrumentation and test equipment.