Intercept Releases New User Interface: Pantheon 7
New Enhanced-footprint CXP Interconnect From TE Connectivity Supports Total Bandwidth Of 120 Gbps Through 12 Channels Of 10 Gbps
National Instruments Releases LabVIEW Toolkit for Machine Prognostics and Health Management

New Enhanced-footprint CXP Interconnect From TE Connectivity Supports Total Bandwidth Of 120 Gbps Through 12 Channels Of 10 Gbps

To support the latest high-speed InfiniBand CXP 12x QDR standard and IEEE 100 Gbps Ethernet specification, TE Connectivity (TE) has developed an enhanced-footprint CXP pluggable connectors and cage in a convenient one-piece, press-fit assembly. This new product supports 12 channels of up to 10 Gbps data rates for a total bandwidth of 120 Gbps, offers improved electrical performance and supports pluggable copper or optical transceivers and active optical cable options.

Engineered for applications in high-speed data environments, the CXP assembly mitigates EMI leakage
at the bezel opening and at the cage-to-plug interface. With an enhanced, dual-sourced footprint that
increases space between the vias, the product reduces cross-talk and improves electrical performance.
The assembly’s one-piece, press-fit design allows for quick and easy placement onto a PCB board –
eliminating the extra steps of assembling the connector and cage, thereby saving manufacturing time and cost. Threaded screw holes are also available as an optional enhancement to secure the CXP assembly onto a board.

Product offerings include lightpipe and EMI/dust plug options as well as three different heat-sink heights to suit various thermal applications. Belly-to-belly mounting options for use on both sides of a PCB board are also offered for high port density applications that require space savings.
Target applications include network switches, routers, storage devices, direct attached storage (DAS),
storage attached networks (SAN), network attached storage (NAS), controller cards and servers.

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