Hybrid FPC-to-board connector offering expanded with ultra-low-profile version

7th September 2022
Paige West

Hirose has enhanced its hybrid flexible printed circuit (FPC) to board connector product family with a 30-position ultra-low-profile version.

The BK10 Series connector has a 0.5mm stacking height and a 1.7mm width that provides significant space savings. Combining a miniature design with a rugged, fully armoured housing makes the BK10 Series ideal for a wide range of portable and wearable electronic devices.

The BK10 Series’ robust housing is covered by a metal shell to prevent housing damage due to misalignment when mating. Multi-point soldering enhances PCB peeling strength, while a dimpled lock design on the contacts provides a high extraction force. Both the power and signal contacts have a two-point contact design, ensuring high contact reliability.

The connector design effectively uses end spacing to expand self-alignment range when mating. Easy mating is achieved via a wide self-alignment range of ±0.29mm in the pitch direction and ±0.24mm in the width direction.

“Hirose continues to expand its comprehensive hybrid FPC-to-board product family to give designers more options that meet the challenging application requirements that portable, handheld, and wearable devices demand,” said Mark Kojak, Chief Marketing Officer and Senior Vice President of Sales and Operations for Hirose Electric USA. “The BK10 Series is our latest FPC-to-board connector that offers a space-saving, fully armoured design to ensure long operational life in mobile device applications.

The hybrid BK10 Series offers 30 signal positions rated at 0.3A and two power contacts rated at 5A. The connector is commonly used for portable devices like audio players, cameras, laptops, and gaming consoles, as well as wearable devices like earbuds, smartwatches, and smart glasses.

The BK10 Series has a rated voltage of 30V AC/DC and an operating temperature of -55 to +85°C.

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