High density FPC-to-board/board-to-board connectors

15th July 2021
Alex Lynn

Hirose has designed an innovative FPC-to-board/board-to-board connector series that offers high density mounting and space-savings. Supporting USB4 Gen2 (10Gbps) transmission for a wide range of portable electronic and consumer devices, the DF40 Series combines a 0.4mm pitch with a mounting depth of only 3.68mm.

The robust DF40 Series connector features a superior stamped contact design with a clear tactile click that confirms secure mating. The stamped contacts enable a longer effective mating length of 0.45mm that provides shock and vibration resistance common to portable device applications. Further protecting signal contacts, the DF40 Series has curved contacts to prevent buckling during mating.

The DF40 Series is available in a number of versions with stacking heights ranging from 4.0mm down to 1.5mm. The DF40 FPC-to-board connector family includes a high temperature version, a positive lock version, EMC shielded versions and versions with or without retention tabs.

"Hirose continues to develop innovative and impactful products that meet our customers’ application requirements," said Mark Kojak, VP of Sales and Marketing for Hirose Electric USA. "The miniature DF40 Series enables customers to go develop smaller end-products without sacrificing performance or reliability."

Easy mating is achieved via a wide self-alignment range of ±0.33 mm in the pitch direction and ±0.33 mm in the width direction. The contact area is enclosed in a housing to protect against solder waste and flux during mounting process. Solder wicking is prevented via a nickel barrier.

The DF40 Series is available in a wide range of positions ranging from ten to 120 depending on the variations. The connector has a rated voltage of 30V AC and a standard operating temperature of -35 oC to +85oC. The high temperature version is rated up to 125 oC.

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