Connectors achieve 56 G PAM4 data rate requirements with higher density

Amphenol Aerospace has developed the MIL-HD2 in alignment with the open group Sensor Open Systems Architecture (SOSA) technical standard.

MIL-HD2 provides developers with a readily available robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56 Gb/s PAM 4 speeds.

This series was selected by the SOSA Consortium and provides a SOSA-aligned solution for NextGen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements.

The connectors enable data rates scalable to 56 Gb/s PAM4 to support system upgrades without costly redesigns.

Features include

  • Proprietary crosstalk-reducing technologies
  • 15.7 mil drill compliant pin allows deeper back drilling
  • Optimised footprints
  • Shielded contacts mate before signal contacts, providing up to a 4 mm minimum wipe
  • Highest density with 1.80 mm pitch
  • Proven EMI and signal integrity advantages
  • Improved impedance matching
  • Enables hot plugging

Applications are:

  • Commercial and military aerospace
  • Missile defence
  • Space data centres and other space systems
  • Radar and sonar equipment
  • Intelligence, surveillance, and reconnaissance systems
  • Ground combat systems
  • Sensors, switches, and integrated processors
  • Electronic warfare (EW) and C5ISR systems
  • Embedded computing
  • Phased array radars
  • Single processing computers

The connectors are in stock at distributor Digi-Key.

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