The connector enables 4.4 TBps with 11 modules on a line card to support next-generation 400 Gigabit Ethernet.
Part of Molex’s zCD Interconnect System, this short-body passive connector accepts both passive and active copper cables. T
he compact form factor is constructed on a straight, back-route footprint with a 0.75 mm pitch.
The small pitch eliminates footprint side-routing, and the overall design of the connector provides industry-leading port-count density with close placement along the panel.
The zCD Interconnect System connector comes equipped with an elastomeric gasket for superior electromagnetic interference (EMI) containment and suppression, a press-fit connector design to ensure a robust and simple board termination, and excellent thermal management that accepts a broad range of customer-specified thermal modules and heat sinks.
The connector is ideal for a wide variety of Ethernet-based applications, including telecommunication devices, core switches, routers, data centres, enterprise computing devices, Top of Rack (TOR) switches, and any other Ethernet application requiring 400 Gbps interfaces.