The DF40 70-position receptacles are also used within Intel’s UI break-out board and the Arduino board, both of which interface with the Edison. The connector, which is available in board-to-board and board-to-FPC versions, has a 0.4mm pitch and 1.5-4.0mm stack height options, making it suitable for high-density mounting. Enabling easy pick-and-place mounting, the device has a minimum width of 3.38mm.
At 1.5mm stacking height, the DF40 has a mating length of 0.45mm. To ensure correct insertion, the connector features a chamfered structure, which allows 0.33mm of self-alignment during mating. The device has a strong mating retention force, preventing accidental unmating. When mating is complete, a click can be heard.
Damage due to physical impact or vibration is minimised by the connector’s reinforced structure and shock- absorbing ribs, which are present on both sides. When mated, a housing covers the fine-pitched contacts, minimising debris intrusion and eliminating the potential for shorting.
The DF40 is available in various positions from 10 to 100. For applications that require high-speed signal transmission and noise prevention, a shielded version is available. The connector is rated for 0.3A and 30V AC/DC, and has a contact resistance which is limited to 90mΩ. Operating across a temperature range of -35 to 85°C, the device provides an insulation resistance of at least 50MΩ at 100VDC. The DF40 connector, which is RoHS compliant and Halogen-free, is available now.
“The versatile and compact DF40 series is available in a range of stacking heights and contact positions to accommodate the needs of many types of products. The covered contact design, shock-absorbing ribs and high mating retention force provide highly reliable performance, making it suitable for applications such as mobile phones and developer chip sets,” said Rick van Weezel, Vice-President of Sales and Marketing, Hirose Electric USA.