ECT’s CCG uses a range of innovative compliant technologies as well as conventional spring probe technologies to build custom connectors and pogos to customer specifications. The group supports both NPI and HVM applications. Machined bodies in a variety of materials are used for small run custom applications. For higher volume applications, molded bodies are used. Connector packaging can be optimized for downstream processes using tape-and-reel or other techniques. This highly interactive design phase from inception to volume presents a simplified “walk-through” approach that benefits both the customer and the end product.
ECT provides a broad spectrum of products, ranging from rugged high power solutions rated over 75 amps to dense .2mm pitch interposers. High reliability solu¬tions for harsh environments and stringent specifications also are available.