10 GHz BGA Socket for DDR4
Clamshell Spring Pin BGA Socket for SPIL’s 36L UFBGA
Why Work On Flash Storage At Micron

Clamshell Spring Pin BGA Socket for SPIL’s 36L UFBGA

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices – CBT-BGA-7011. The contactor is a stamped spring pin with 34 gram actuation force per ball and cycle life of 500,000 insertions.

The self inductance of the contactor is 0.9 nH, insertion loss < 1 dB at 9.1 GHz and capacitance 0.03pF. The current capacity of each contactor is 2.2 amps at 30C temperature rise. Socket temperature range is -55C to +155C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-7011 is a BGA, 3x3mm, 0.4mm pitch, 36 position, 6x6 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering. To use, place the BGA device into the socket base and lock the clamshell socket lid on to the base using the latch. The socket uses a compression wave spring to apply constant downward pressure enabling the device be interconnected to the target PCB. This socket can be used for hand test and quick device screening applications with the most stringent requirements. Pricing for the CBT-BGA-7011 is $442 at qty 1 with reduced pricing available depending on quantity required.

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