As well as being faced with severe space constraints, Schroff engineers had to incorporate EMC shielding into key parts of the audio system and, above all, provide effective yet quiet cooling of the densely packed electronics.
To meet these demanding requirements, Schroff supplied 3U and 10U enclosure solutions based on standard europacPRO components, together with custom parts such as air deflectors, side panels with special perforations, rear component assemblies and reinforced backplane mounting.
In addition, Schroff designed a special backplane and also developed specially modified, compact, redundant PSUs to meet requirements for high power density and availability.