The new dielectric has an extremely high thermal conductivity of 3.0W/m-K , resulting in a very low thermal resistance of only 0.13°Ccm2/W. The dielectric thickness is 38µm, and is available on all Bergquist Thermal Clad aluminium and copper Insulated Metal Substrates (IMS). Displaying vastly superior thermal performance compared to standard FR4 PCBs, Thermal Clad HPL is supplied as scored array circuits, scored singulated circuits, or punched singulated parts.
By efficiently removing heat generated from surface-mounted high-power LEDs, Thermal Clad HPL promotes reliability by minimising the operating temperature for a given LED driving current. Engineers thus gain extra freedom to optimise light output, component count and lumen maintenance in equipment such as energy-saving lamps, LED-based bulb replacements, signage, stage lighting and display backlights.
With a maximum operating temperature of 150°C and continuous operating voltage of 170V DC (120V AC), the new dielectric can be used in a wide variety of environments and applications.