The high-capillary mesh wick allows for cooling capacities that range from 5 to 35W. The minimum achievable thickness in the heatpipe is 0.6mm, which suits it for most confined-space requirements. In addition, the heatpipes are bendable, and can be pressed (for different height options). They can be ordered in different thickness levels, in either copper or aluminium.
Applications include LED modules, tablet PCs, mobile phones and other electronic devices that require cooling within extreme space limitations. Specific examples include Intel’s low voltage chips, which run at 17W (in its next-gen Ultra-Book).