Enclosures

Laird Technologies Releases the Newest in a Series of Thermal Management Application Notes

15th January 2010
ES Admin
0
Laird Technologies today announced the release of its newest application note titled “Thermoelectric Assemblies for Food and Beverage Applications”. This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.
Laird Technologies today announced the release of its newest application note titled “Thermoelectric Assemblies for Food and Beverage Applications”. This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.



The application note describes why Thermoelectric Assemblies (TEAs) are an ideal thermal management solution for many food and beverage applications such vending machines, wine coolers, temperature-controlled mobile food trolleys, high-end coffee dispensing machines, countertop chillers, hotel and dorm room mini-bars, and mini-keg coolers. A wide range of small-and medium-sized heat pumping TEAs are beneficial to most food and beverage device requirements, providing temperature regulation of perishable foods and beverages and utilization of very tight space constraints.



“TEAs offer many benefits including compact size, low weight and lower total cost of ownership versus alternate cooling technologies,” stated Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. “Their solid-state construction adds to their overall value to food and beverage applications by providing long term reliability while minimizing maintenance and replacement of cooling systems in the field.”



In today’s complex retail, outdoor, and service operating environments, TEAs are necessary to provide precise temperature control via cooling and heating in a variety of modular platforms. Their advanced capabilities are aided by new material technologies, thinner profiles, and automated assembly. Combining these special benefits make TEAs the only effective solution for many food and beverage thermal management applications by offering greater performance, higher reliability, and low cost of ownership.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier