AAEON Releases New Rugged Fanless Panel Computers
New series of small cases provides versatile enclosure solution for PCBs
Flexible CMOS Process Development from Toshiba

New series of small cases provides versatile enclosure solution for PCBs

Schroff has introduced a new family of handy extruded-aluminium cases that provide a versatile and robust housing for either standardised or non-standard PCBs. Known as minipac, the new enclosures are available in two different shapes: the trapezoidal version can accept three boards measuring 50, 60 and 65mm in width, while the rectangular style is designed to accommodate either four standard 160 x 100mm boards or eight 160 x 60mm boards.

As the cases are formed from aluminium extrusions, they can be specified in any practical length and in any quantity from a single unit upwards.

Suitable for wall mounting, DIN-rail mounting or use as a desktop enclosure, minipac cases are ideal for accommodating single-board computers or COM modules, for example in test and measurement, industrial, networking or railway applications. Optimal heat dissipation is ensured by the large aluminium surface area, and the cases offer environmental protection to IP40. For users requiring an individual design, covers and front panels can be supplied with custom modifications such as cut-outs and screen printing.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

AAEON Releases New Rugged Fanless Panel Computers

Next Post

Flexible CMOS Process Development from Toshiba