Development embedded platform features removable sidewalls

11th May 2017
Lanna Cooper


Pixus Technologies now offers a development enclosure for 3, 6U, or custom sized boards with sidewalls that can be removed. This feature allows a system to be enclosed for thermal testing and the walls to be taken out for ease of access to boards inside the chassis.


The VPXD1000R holds up to eight backplane slots at a 1.0” pitch. Pixus offers 3 and 6U backplanes in OpenVPX, CompactPCI Serial, VME64x, and legacy CompactPCI and VME designs. The card guides can be adjusted in 0.2” increments to accept various slot pitches.

Further, Pixus offers removable conduction-cooled card guides. This allows IEEE 1101.2 conduction-cooled modules to be tested next to other air-cooled cards inside the same enclosure.

The Pixus development enclosure has removable sidewalls for both front pluggable cards and the optional RTM (Rear Transition Module) section. The unit has standard 600 or 1200W modular power supplies for a wide range of voltages and amperage levels commonly used in OpenVPX and other architectures. Customised versions or VITA 62 PSUs are also available. Pixus offers power interface boards per PICMG 2.11 and VITA 62 to accept various pluggable power supplies. The VPXD1000R also features an adjustable fan speed dial. 

Pixus offers desktop, rackmount, and rugged SFF embedded enclosure systems for Eurocard-based, xTCA, and customised solutions. The company also provides components for embedded subracks and boards, as well as electronics cases for instrumentation.

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