In fact, when ProDEK was field tested at several leading electronics assembly firms, there was an average of nearly 50% reduction in defects from the offset correction functionality alone.
“It was great to be able to show delegates at SMT Hybrid Packaging how ProDEK can make their printer smarter and more intuitive,” said Stefan Techau, General Manager Electronics Assembly for Europe at DEK. “Working alongside solder paste inspection and developed with unique print software capability, ProDEK uses a high level of process reference to provide print alignment precision and cleaning functionality.”
At the show, DEK also showcased its total optimised solution with the combination of Nano-ProTek, a breakthrough stencil coating technology that delivers high performance stencils in a cost-effective wipe, SMT Under-Stencil Cleaning Fabric Roll and water based chemistry, Pro XF. With the total optimised solution, the cleaning process is minimized, yet fast and effective when needed, reducing the total cost of ownership.
DEK’s productivity tools, which are designed to further extend the capabilities of even the most advanced technologies, were also on stand, including ProActiv, HawkEye Bridging, ProFlow ATx and Over Top Snuggers.