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Compact MicroTCA system houses up to six AdvancedMC modules

New from electronics packaging specialist Schroff is a compact MicroTCA system that can accommodate up to six single mid-size AdvancedMC modules in a 19in enclosure with a height of only 1U. Featuring a special case design that ensures efficient cooling of the modules, the 1U MicroTCA system is ideal for use in high-performance multi-processor systems where rack space may be limited – for example, in industrial or transportation applications.

Enclosures

22 May 2009

byNews Desk

It provides six slots for horizontal mounting of the AdvancedMC modules, as well as a dedicated slot for a MicroTCA carrier hub (MCH). In addition, the 1U system is equipped with

a special MicroTCA backplane, a built-in power supply and a hot-swap-capable fan tray.
The topology of the MicroTCA backplane has been designed to allow simultaneous use of different software protocols, and all AdvancedMC slots are fully compatible with PICMG AMC.0 R2.0, the Advanced Mezzanine Card base specification.

With a depth of 350mm, the 1U system includes a 250W AC power supply unit behind the backplane, with a MicroTCA-compatible power management module in the form of a mezzanine board mounted on the rear of the backplane.

Efficient cooling is achieved by the temperature-controlled fan tray, combined with the triangular design of the side vents, which increases the effective air inlet and exhaust volumes by some 30%. The result is a cooling capacity of 30W per AdvancedMC module and 40W for the MCH, with a maximum temperature rise inside the chassis of only 12.5 degC.